发明授权
- 专利标题： Elongated bonding pad for wire bonding and sort probing
- 专利标题（中）： 用于引线接合和分选探测的伸长焊接垫
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申请号： US10699118申请日： 2003-10-31
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公开(公告)号： US07091613B1公开(公告)日： 2006-08-15
- 发明人: Jon M. Long , Joseph W. Foerstel
- 申请人： Jon M. Long , Joseph W. Foerstel
- 申请人地址： US CA San Jose
- 专利权人： Altera Corporation
- 当前专利权人： Altera Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Morgan, Lewis & Bockius LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An elongated bonding pad comprises two areas, a bonding area and an elongated probing area. The bonding area is located on the edge of an integrated circuit device for wire bonding. The elongated probing area is located on the inner area of the device. The long dimension of the elongated probing area is large enough for carrying a probing mark and the short dimension of the probing area is electrically and mechanically connected to the bonding area. Such elongated bonding pad can reduce the possibility of bonding wire open failures caused by wafer sort probing and increase the device's capacity of hosting more electrical components.
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