发明授权
- 专利标题： High density DSX system
- 专利标题（中）： 高密度DSX系统
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申请号： US10277174申请日： 2002-10-18
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公开(公告)号： US07095844B2公开(公告)日： 2006-08-22
- 发明人: Scott K. Baker , James D. Dewey , Dominic J. Louwagie , Harvey J. Chouanard
- 申请人： Scott K. Baker , James D. Dewey , Dominic J. Louwagie , Harvey J. Chouanard
- 申请人地址： US MN Eden Prairie
- 专利权人： ADC Telecommunications, Inc.
- 当前专利权人： ADC Telecommunications, Inc.
- 当前专利权人地址： US MN Eden Prairie
- 代理机构： Merchant & Gould P.C.
- 主分类号： H04M3/00
- IPC分类号： H04M3/00 ; H01R24/04
摘要：
A DSX system arranged to receive a plurality of high-density chassis is disclosed. The chassis include back planes having rear access IN/OUT fields and rear access cross-connect fields. The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.
公开/授权文献
- US20040076284A1 High density DSX system 公开/授权日：2004-04-22
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