- 专利标题： Ultra thin image sensor package structure and method for fabrication
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申请号： US10865983申请日： 2004-06-12
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公开(公告)号： US07102159B2公开(公告)日： 2006-09-05
- 发明人: Chen Jung Tsai , Chih-Wen Lin
- 申请人： Chen Jung Tsai , Chih-Wen Lin
- 申请人地址： TW Hsinchu
- 专利权人： Macronix International Co., Ltd.
- 当前专利权人： Macronix International Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Stout, Uxa, Buyan & Mullins, LLP
- 主分类号： H01L29/04
- IPC分类号： H01L29/04
摘要：
An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.
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