发明授权
- 专利标题： Heat sink retention device
- 专利标题（中）： 散热片保持装置
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申请号： US10990078申请日： 2004-11-16
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公开(公告)号： US07102890B2公开(公告)日： 2006-09-05
- 发明人: Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
- 申请人： Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
- 申请人地址： TW
- 专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： TW
- 代理机构： Morris Manning & Martin
- 代理商 Tim Tingkang Xia, Esq.
- 优先权： CN92222758 20031226
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
The retention device comprises a clip and a back plate engaging the clip, the clip comprises pressing members for press the heat sink onto the processor and at least a pair of hooks, the back plate is placed below a printed circuit board on which the processor is mounted, and comprises a body and at least a pair of retaining rings mounted thereof. The retaining rings travel through mounting holes in the printed circuit board and beyond the top surface thereof for catching the hooks of the clip.
公开/授权文献
- US20050141202A1 Heat sink retention device 公开/授权日：2005-06-30
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