A mating extender electrically engages with a pair of complementary connectors. The mating extender comprises an insulative housing having first and second mating sections, and a number of wafers parallelly assembled into the insulative housing. Each wafer comprises an insulative frame and a plurality of contacts each formed by a pair of electrically stacked semi-contacts. Each contact has an intermediate portion retained in the insulative frame, a pair of first contact tails and a pair of second contact tails at opposite ends of the intermediate portion and received in the first and the second mating sections of the insulative housing, respectively.