Invention Grant
- Patent Title: Keypad assembly
- Patent Title (中): 键盘装配
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Application No.: US10944018Application Date: 2004-09-17
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Publication No.: US07106222B2Publication Date: 2006-09-12
- Inventor: Isaac Ward , Kenneth Weselake
- Applicant: Isaac Ward , Kenneth Weselake
- Applicant Address: US FL Boca Raton
- Assignee: Siemens Communications, Inc.
- Current Assignee: Siemens Communications, Inc.
- Current Assignee Address: US FL Boca Raton
- Main IPC: H03M11/00
- IPC: H03M11/00
Abstract:
A keypad assembly utilizes touch-detecting apparatus such as force sensors or touchpad assemblies for registering key presses. In exemplary embodiments, the keypad assembly is suitable for use in electronic devices such as a mobile telephones, calculators, hand-held computers, or the like, having single piece molded housings wherein the keypad assembly is at least partially encapsulated within the housing.
Public/Granted literature
- US20050042012A1 Keypad assembly Public/Granted day:2005-02-24
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