- 专利标题: High density planar electrical interface
-
申请号: US09886521申请日: 2001-06-20
-
公开(公告)号: US07108546B2公开(公告)日: 2006-09-19
- 发明人: Charles A. Miller , Benjamin N. Eldridge
- 申请人: Charles A. Miller , Benjamin N. Eldridge
- 申请人地址: US CA Livermore
- 专利权人: FormFactor, Inc.
- 当前专利权人: FormFactor, Inc.
- 当前专利权人地址: US CA Livermore
- 代理商 N. Kenneth Burraston
- 主分类号: H01R9/05
- IPC分类号: H01R9/05
摘要:
An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
公开/授权文献
- US20020195265A1 High density planar electrical interface 公开/授权日:2002-12-26
信息查询