发明授权
- 专利标题： Method and device for polishing
- 专利标题（中）： 抛光方法和装置
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申请号： US10485273申请日： 2003-02-20
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公开(公告)号： US07108579B2公开(公告)日： 2006-09-19
- 发明人: Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
- 申请人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2002-043471 20020220
- 国际申请： PCT/JP03/01869 WO 20030220
- 国际公布： WO03/071592 WO 20030828
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B24B1/00
摘要：
The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
公开/授权文献
- US20040235301A1 Method and device for polishing 公开/授权日：2004-11-25
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