发明授权
- 专利标题： Substrate holding apparatus and polishing apparatus
- 专利标题（中）： 基板保持装置和抛光装置
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申请号： US10874317申请日： 2004-06-24
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公开(公告)号： US07108592B2公开(公告)日： 2006-09-19
- 发明人: Koichi Fukaya , Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima
- 申请人： Koichi Fukaya , Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2003-180044 20030624
- 主分类号： B24B29/00
- IPC分类号： B24B29/00 ; B24B47/02
摘要：
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.
公开/授权文献
- US20050028931A1 Substrate holding apparatus and polishing apparatus 公开/授权日：2005-02-10