Invention Grant
US07109581B2 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
有权
在集成电路微型冷却器的设计和制造中使用自组装纳米结构的系统和方法
- Patent Title: System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
- Patent Title (中): 在集成电路微型冷却器的设计和制造中使用自组装纳米结构的系统和方法
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Application No.: US10925824Application Date: 2004-08-24
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Publication No.: US07109581B2Publication Date: 2006-09-19
- Inventor: Carlos Dangelo , Meyya Meyyappan , Jun Li
- Applicant: Carlos Dangelo , Meyya Meyyappan , Jun Li
- Applicant Address: US CA Sunnyvale
- Assignee: Nanoconduction, Inc.
- Current Assignee: Nanoconduction, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
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