Invention Grant
US07109828B2 Surface acoustic wave device, and mobile communication device and sensor both using same
有权
表面声波装置,以及移动通信装置和传感器都采用相同的方式
- Patent Title: Surface acoustic wave device, and mobile communication device and sensor both using same
- Patent Title (中): 表面声波装置,以及移动通信装置和传感器都采用相同的方式
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Application No.: US10482442Application Date: 2003-04-14
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Publication No.: US07109828B2Publication Date: 2006-09-19
- Inventor: Ryoichi Takayama , Shunichi Seki , Tetsuo Kawasaki , Hidekazu Nakanishi , Koji Hasegawa
- Applicant: Ryoichi Takayama , Shunichi Seki , Tetsuo Kawasaki , Hidekazu Nakanishi , Koji Hasegawa
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2002-111715 20020415
- International Application: PCT/JP03/04692 WO 20030414
- International Announcement: WO03/088483 WO 20031023
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/64

Abstract:
In a surface acoustic wave (SAW) device, such as a SAW resonator or a SAW filter, loss is minimized and steep characteristics are improved. IDT electrodes and a reflector are provided to a piezoelectric substrate cut out at a cut-angle which allows the substrate to excite a leaky surface acoustic wave (LSAW). The IDT electrodes have a given film thickness and a given pitch “p” of finger-electrodes. A phase velocity of the SAW is reduced to slower than a phase velocity “vb”of a slow shear wave propagating on the piezoelectric substrate, and a resonance frequency “f” satisfies a relation of 2×p≦vb/f. This structure allows the use of a Rayleigh surface acoustic wave (RSAW) which does not produce propagation loss, and improving insertion-loss and steep characteristics from those of a conventional SAW device using the LSAW.
Public/Granted literature
- US20040174233A1 Surface acoustic wave device, and mobile communication device and sensor both using same Public/Granted day:2004-09-09
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