Invention Grant
- Patent Title: Method and apparatus for making very low roughness copper foil
- Patent Title (中): 制造非常低的粗糙度铜箔的方法和装置
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Application No.: US10722469Application Date: 2003-11-28
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Publication No.: US07112271B2Publication Date: 2006-09-26
- Inventor: Cha Jae Jo , Chang Hee Choi , Sangyum Kim , Jeong Ik Kim
- Applicant: Cha Jae Jo , Chang Hee Choi , Sangyum Kim , Jeong Ik Kim
- Applicant Address: KR Seoul
- Assignee: LG Cable Ltd.
- Current Assignee: LG Cable Ltd.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2002-0075412 20021129
- Main IPC: C25F3/16
- IPC: C25F3/16
Abstract:
A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.
Public/Granted literature
- US20040108216A1 Method and apparatus for making very low roughness copper foil Public/Granted day:2004-06-10
Information query
