发明授权
- 专利标题： Pretreatment for an electroplating process and an electroplating process in including the pretreatment
- 专利标题（中）： 包括预处理的电镀工艺和电镀工艺的预处理
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申请号： US10766491申请日： 2004-01-28
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公开(公告)号： US07112540B2公开(公告)日： 2006-09-26
- 发明人: Richard L. Guldi , Deepak Ramappa
- 申请人： Richard L. Guldi , Deepak Ramappa
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Jacqueline J. Garner; W. James Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L21/31
- IPC分类号： H01L21/31 ; H01L23/52
摘要：
The present invention provides an electroplating process and a method for manufacturing an integrated circuit. The electroplating process includes, among other steps, placing a substrate 290 in an enclosure 200 being substantially devoid of unwanted contaminants and forming a material layer 310 over the substrate 290 within the enclosure 200, the enclosure 200 still being substantially devoid of the unwanted contaminants. The electroplating process further includes forming a thin layer of oxide 410 over the material layer 310 within the enclosure 200, the enclosure 200 still being substantially devoid of the unwanted contaminants during the forming the thin layer of oxide 410.
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