发明授权
- 专利标题: Method and apparatus for dynamically measuring the thickness of an object
- 专利标题(中): 用于动态测量物体厚度的方法和装置
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申请号: US10685210申请日: 2003-10-14
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公开(公告)号: US07112961B2公开(公告)日: 2006-09-26
- 发明人: Lawrence C. Lei , Siqing Lu , Yu Chang , Cecilia Martner , Quyen Pham , Yu Ping Gu , Joel Huston , Paul Smith , Gabriel Lorimer Miller
- 申请人: Lawrence C. Lei , Siqing Lu , Yu Chang , Cecilia Martner , Quyen Pham , Yu Ping Gu , Joel Huston , Paul Smith , Gabriel Lorimer Miller
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Wilmer Cutler Pickering Hale & Dorr
- 主分类号: G01B7/06
- IPC分类号: G01B7/06 ; G01N27/72
摘要:
A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.
公开/授权文献
- US20040140797A1 Method and apparatus for measuring object thickness 公开/授权日:2004-07-22
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