Invention Grant
- Patent Title: Method, apparatus and computer product for substrate processing
- Patent Title (中): 用于基板加工的方法,设备和计算机产品
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Application No.: US10662881Application Date: 2003-09-16
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Publication No.: US07113253B2Publication Date: 2006-09-26
- Inventor: Reinder Teun Plug
- Applicant: Reinder Teun Plug
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03B27/42 ; G03D5/00 ; B05C11/00 ; G06F19/00

Abstract:
A method, apparatus and computer product for processing of substrates in at least a part of a substrate processing system is provided. In an embodiment, the method includes obtaining, using a processing unit, at least one of a rate of processing and a time of processing of a plurality of substrate lots to be introduced into a part of the substrate processing system and determining, using the processing unit, an order of introduction of the plurality of substrate lots into the part of the substrate processing system to at least one of increase the rate of processing and decrease the time of processing of the plurality of substrate lots.
Public/Granted literature
- US20050058446A1 Method, apparatus and computer product for substrate processing Public/Granted day:2005-03-17
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