发明授权
- 专利标题: Surface-mount thin-profile capacitor and method of producing the same
- 专利标题(中): 表面贴装薄型电容器及其制造方法
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申请号: US11037509申请日: 2005-01-18
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公开(公告)号: US07113390B2公开(公告)日: 2006-09-26
- 发明人: Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
- 申请人: Yuichi Maruko , Akihiro Kawai , Toshihisa Nagasawa , Tadamasa Asami
- 申请人地址: JP Sendai JP Toyama
- 专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人地址: JP Sendai JP Toyama
- 代理机构: Frishauf, Holtz, Goodman & Chick, P.C.
- 优先权: JP2004-018489 20040127
- 主分类号: H01G9/00
- IPC分类号: H01G9/00
摘要:
In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.
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