Invention Grant
- Patent Title: Transgenic pig containing heat shock protein 70 transgene
- Patent Title (中): 转基因猪含有热休克蛋白70转基因
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Application No.: US10350354Application Date: 2003-01-24
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Publication No.: US07115796B2Publication Date: 2006-10-03
- Inventor: Bor-Show Tzang , Ching-Fu Tu , Wen-Chuan Lee , Ming-Yu Chen , San-Yuan Huang , Jyh-Hung Lin
- Applicant: Bor-Show Tzang , Ching-Fu Tu , Wen-Chuan Lee , Ming-Yu Chen , San-Yuan Huang , Jyh-Hung Lin
- Applicant Address: TW
- Assignee: Animal Technology Institute
- Current Assignee: Animal Technology Institute
- Current Assignee Address: TW
- Agency: Rothwell, Figg, Ernst & Manbeck, PC
- Main IPC: A01K67/027
- IPC: A01K67/027

Abstract:
The invention provides a transgenic pig having incorporated into its genome a HSP70 gene or fragment thereof, whereby the transgenic pig overexpresses HSP70. The transgenic pig of the invention can be used in the production of HSP in large quantities, as a xenograft source for transplantation and as an animal model close to human for illustrating the protective roles of HSP. Furthermore, the transgenic pig of the invention has a better meat quality and exhibits an increased growth rate and a reduced backfat thickness.
Public/Granted literature
- US20030208786A1 Transgenic pig containing heat shock protein 70 transgene Public/Granted day:2003-11-06
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