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US07115954B2 Semiconductor device including stress inducing films formed over n-channel and p-channel field effect transistors and a method of manufacturing the same 有权
包括在n沟道和p沟道场效应晶体管上形成的应力诱导膜的半导体器件及其制造方法

Semiconductor device including stress inducing films formed over n-channel and p-channel field effect transistors and a method of manufacturing the same
摘要:
A semiconductor device has an n channel conductivity type field effect transistor having a channel formation region formed in a first region on one main surface of a semiconductor substrate and a p channel conductivity type field effect transistor having a channel formation region formed in a second region on the main surface of the semiconductor substrate, which second region is different from the first region. An internal stress generated in the channel formation region of the n channel conductivity type field effect transistor is different from an internal stress generated in the channel formation region of the p channel conductivity type field effect transistor. The internal stress generated in the channel formation region of the n channel conductivity type field effect transistor is a tensile stress, while the internal stress generated in the channel formation region of the p channel conductivity type field effect transistor is a compressive stress.
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