Invention Grant
- Patent Title: Method for modifying a stamping die to compensate for springback
- Patent Title (中): 修正冲压模以补偿回弹的方法
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Application No.: US11278327Application Date: 2006-03-31
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Publication No.: US07117065B1Publication Date: 2006-10-03
- Inventor: Zhiyong Cedric Xia , Feng Ren
- Applicant: Zhiyong Cedric Xia , Feng Ren
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Artz & Artz
- Agent David B. Kelley
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B11/01 ; G06G7/48

Abstract:
A method for modifying a stamping die to compensate for springback includes the steps of stamping a first part using a base, or pre-existing die set, and creating a surrogate die having the shape of the first stamped part. These steps are followed by simulated stamping of a blank with the surrogate die, where the blank is shaped according to the desired finished part. Then, the base die is modified by mapping the forming stresses, from the stamped blank, to an indicator blank, which is allowed to relax and then is employed as a template for modification of the base die. Following this, the accuracy of the newly modified base die is determined by stamping a second part in the modified base die and by comparing a number of dimensions of the second part with a number of corresponding dimensions of the desired finished part.
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