发明授权
US07120181B1 Semiconductor laser device and method of fabricating the same 失效
半导体激光器件及其制造方法

Semiconductor laser device and method of fabricating the same
摘要:
In a semiconductor laser device, an AlGaN buffer layer, a GaN layer, an n-GaN layer, an n-AlGaN cladding layer, an MQW light emitting layer, a p-AlGaN cladding layer, a p-first GaN cap layer, a current blocking layer composed of n-AlGaN, and a p-second GaN cap layer are stacked in this order on a sapphire substrate, and a ridge portion having an upper surface having a width W1 is formed by etching. The current blocking layer has an opening having a width W2 on the upper surface of the ridge portion. The width W2 of the opening is smaller than the width W1 of the upper surface of the ridge portion. Accordingly, in a light emitting region of the MQW light emitting layer, a saturable light absorbing region is formed on both sides of a current injection region.
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