发明授权
- 专利标题: Semiconductor laser device and method of fabricating the same
- 专利标题(中): 半导体激光器件及其制造方法
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申请号: US09532786申请日: 2000-03-22
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公开(公告)号: US07120181B1公开(公告)日: 2006-10-10
- 发明人: Nobuhiko Hayashi , Takenori Goto
- 申请人: Nobuhiko Hayashi , Takenori Goto
- 申请人地址: JP Moriguchi
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Moriguchi
- 代理机构: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP
- 优先权: JP11-079469 19990324
- 主分类号: H01S5/00
- IPC分类号: H01S5/00
摘要:
In a semiconductor laser device, an AlGaN buffer layer, a GaN layer, an n-GaN layer, an n-AlGaN cladding layer, an MQW light emitting layer, a p-AlGaN cladding layer, a p-first GaN cap layer, a current blocking layer composed of n-AlGaN, and a p-second GaN cap layer are stacked in this order on a sapphire substrate, and a ridge portion having an upper surface having a width W1 is formed by etching. The current blocking layer has an opening having a width W2 on the upper surface of the ridge portion. The width W2 of the opening is smaller than the width W1 of the upper surface of the ridge portion. Accordingly, in a light emitting region of the MQW light emitting layer, a saturable light absorbing region is formed on both sides of a current injection region.
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