Invention Grant
- Patent Title: Contact spring assembly, especially for an antenna amplifier
- Patent Title (中): 接触弹簧组件，特别是天线放大器
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Application No.: US10960429Application Date: 2004-10-06
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Publication No.: US07121835B2Publication Date: 2006-10-17
- Inventor: David Silva
- Applicant: David Silva
- Applicant Address: DE Neckartenzlingen
- Assignee: Hirschmann Electronics GmbH & Co. KG
- Current Assignee: Hirschmann Electronics GmbH & Co. KG
- Current Assignee Address: DE Neckartenzlingen
- Agent Andrew Wilford
- Priority: DE10347917 20031010; DE102004011601 20040310
- Main IPC: H01R41/00
- IPC: H01R41/00
Abstract:
A contact spring assembly has a contact plate with a window in which a contact spring is received, the contact spring having bent strips engageable with an antenna amplifier and an antenna amplifier structure. The contact spring is fixed at one end and movable at its other end on the support plate.
Public/Granted literature
- US20050090158A1 Contact spring assembly, especially for an antenna amplifier Public/Granted day:2005-04-28
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