发明授权
- 专利标题: Method and device for connecting conductors
- 专利标题(中): 连接导体的方法和装置
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申请号: US10450527申请日: 2002-01-11
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公开(公告)号: US07124504B2公开(公告)日: 2006-10-24
- 发明人: Ernst Steiner , Dieter Stroh , Horst Dieterle
- 申请人: Ernst Steiner , Dieter Stroh , Horst Dieterle
- 申请人地址: DE Wettenberg
- 专利权人: Schunk Ultraschalltechnik GmbH
- 当前专利权人: Schunk Ultraschalltechnik GmbH
- 当前专利权人地址: DE Wettenberg
- 代理机构: Dennison, Schultz & MacDonald
- 优先权: DE10101236 20010112
- 国际申请: PCT/EP02/00198 WO 20020111
- 国际公布: WO02/061895 WO 20020808
- 主分类号: H01R43/20
- IPC分类号: H01R43/20 ; H01R43/00 ; H01R43/02 ; H01R9/00 ; B29C65/08 ; B23K1/06 ; B23K20/10
摘要:
A method and device for making multiple connections between electrical conductors surrounded by external insulators in overlapping flexible cables by ultrasonic welding. Overlapping conductors to be connected are arranged on a surface of a carrier disposed between a sonotrode and an electrode, the sonotrode and electrode are sequentially aligned the with overlapping points to be welded, and the conductors are ultrasonically welded at each of the overlapping points. The carrier either includes the electrode at least in designated areas, or includes penetrations constructed and arranged to receive an electrode in designated areas.
公开/授权文献
- US20040038598A1 Method and device for connecting conductors 公开/授权日:2004-02-26
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