Invention Grant
- Patent Title: Method for producing nanosilica plates
- Patent Title (中): 纳米二氧化硅板的制造方法
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Application No.: US10685213Application Date: 2003-10-14
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Publication No.: US07125916B2Publication Date: 2006-10-24
- Inventor: Jiang-Jen Lin , Chien-Chia Chu
- Applicant: Jiang-Jen Lin , Chien-Chia Chu
- Applicant Address: TW Taichung
- Assignee: National Chung-Hsing University
- Current Assignee: National Chung-Hsing University
- Current Assignee Address: TW Taichung
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08K3/34

Abstract:
The present invention relates to an exfoliating agent and to a process for producing random form of nanoscale silicate plates. Two types of exfoliating agents are applied in the present invention, which respectively have the formula: wherein R is a polyoxybutylene group, polyoxypropylene group, poly(oxyethylene/oxypropylene) group, or polyoxyethylene group. In this invention, layered silicate clays are exfoliated into random silicate plates by acidifying AMO or AEO with inorganic acid, adding the acidified AMO or AEO to layered silicate clay with agitation, and adding sodium hydroxide or chloride of alkali metal or alkaline-earth metal, in ethanol, water and a hydrophobic organic solvent to the intermediate product and repeating phase separation procedures to isolate random silicate plates from water phase.
Public/Granted literature
- US20050080180A1 Method for producing nanosilica plates Public/Granted day:2005-04-14
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