发明授权
- 专利标题： Light emitting device assembly
- 专利标题（中）： 发光器件组件
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申请号： US10938556申请日： 2004-09-13
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公开(公告)号： US07126165B2公开(公告)日： 2006-10-24
- 发明人: Joon-seop Kwak , Jong-wan Kim , Su-hee Chae
- 申请人： Joon-seop Kwak , Jong-wan Kim , Su-hee Chae
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Buchanan Ingersoll PC
- 优先权： KR10-2003-0068991 20031004
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L23/48
摘要：
Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad.
公开/授权文献
- US20050072984A1 Light emitting device assembly 公开/授权日：2005-04-07
信息查询
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