Invention Grant
- Patent Title: Hybrid-integrated high-speed OTDM module
- Patent Title (中): 混合集成高速OTDM模块
-
Application No.: US09988053Application Date: 2001-11-16
-
Publication No.: US07127174B2Publication Date: 2006-10-24
- Inventor: Tiangong Liu , Jinghui Li , Tongqing Wang
- Applicant: Tiangong Liu , Jinghui Li , Tongqing Wang
- Applicant Address: US CA San Jose
- Assignee: Oplink Communications, Inc.
- Current Assignee: Oplink Communications, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Fish & Richardson P.C.
- Main IPC: H04J14/08
- IPC: H04J14/08

Abstract:
A novel optical time division multiplexing (OTDM) module based on hybrid-integrated optical chips is disclosed. An integrated modulator chip generates optical RZ signal streams which are then interleaved in an integrated time-delay chip to produce an OTDM signal. The integrated modulator chip is coupled and secured to the integrated time-delay chip via a suitable optical index-matching layer or collimating lenses. Such an approach alleviates the stability problems offered by conventional fiber-based OTDM technology and aids in reducing the size and complexity as well as lowering the cost for the assembly. Furthermore, the time-delay chip of the present invention offers fine tuning capabilities thereby allowing for slight adjustments in the interleaving of optical signal streams when non-standard data transmission rates are required.
Public/Granted literature
- US20030095311A1 Hyrbid-integrated high-speed OTDM module Public/Granted day:2003-05-22
Information query