Invention Grant
US07127809B2 Method of forming one or more base structures on an LTCC cofired module
有权
在LTCC共烧模块上形成一个或多个基础结构的方法
- Patent Title: Method of forming one or more base structures on an LTCC cofired module
- Patent Title (中): 在LTCC共烧模块上形成一个或多个基础结构的方法
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Application No.: US10802746Application Date: 2004-03-18
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Publication No.: US07127809B2Publication Date: 2006-10-31
- Inventor: Cynthia W. Berry , Alex E. Bailey , Robert Fisher , Tapan K. Gupta , Daniel Brosey , Steve M. Smalley , William A. Thomas
- Applicant: Cynthia W. Berry , Alex E. Bailey , Robert Fisher , Tapan K. Gupta , Daniel Brosey , Steve M. Smalley , William A. Thomas
- Applicant Address: US CA Los Angeles
- Assignee: Northrop Grumman Corporation
- Current Assignee: Northrop Grumman Corporation
- Current Assignee Address: US CA Los Angeles
- Agency: Birch, Stewart Kolasch & Birch, LLP
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.
Public/Granted literature
- US20050205195A1 Method of forming one or more base structures on an LTCC cofired module Public/Granted day:2005-09-22
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