Invention Grant
- Patent Title: Probe card covering system and method
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Application No.: US11264948Application Date: 2005-11-01
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Publication No.: US07128587B2Publication Date: 2006-10-31
- Inventor: Benjamin N. Eldridge , Carl V. Reynolds
- Applicant: Benjamin N. Eldridge , Carl V. Reynolds
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H01R13/44
- IPC: H01R13/44
Abstract:
The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.
Public/Granted literature
- US20060057875A1 Probe card covering system and method Public/Granted day:2006-03-16
Information query
