Invention Grant
US07128835B1 Fluid treatment packs, fluid treatment elements, and methods for treating fluids
有权
流体处理包装，流体处理元件和处理流体的方法
- Patent Title: Fluid treatment packs, fluid treatment elements, and methods for treating fluids
- Patent Title (中): 流体处理包装，流体处理元件和处理流体的方法
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Application No.: US10130831Application Date: 2000-11-22
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Publication No.: US07128835B1Publication Date: 2006-10-31
- Inventor: Ronald D. Hundley , Scott A. Whitney , Angela M. Griffin , Conrad J. Christel , Leonard E. Bensch , Kenneth M. Williamson , Joseph G. Adiletta
- Applicant: Ronald D. Hundley , Scott A. Whitney , Angela M. Griffin , Conrad J. Christel , Leonard E. Bensch , Kenneth M. Williamson , Joseph G. Adiletta
- Applicant Address: US NY East Hills
- Assignee: Pall Corporation
- Current Assignee: Pall Corporation
- Current Assignee Address: US NY East Hills
- Agency: Leydig, Voit & Mayer, Ltd.
- International Application: PCT/US00/31949 WO 20001122
- International Announcement: WO01/37969 WO 20010531
- Main IPC: B01D39/14
- IPC: B01D39/14
Abstract:
A fluid treatment element for treating a fluid flowing through the element comprises a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The element further comprises a nonconductive porous treatment medium between the first and second conductive layers. The first and second conductive layers are positioned to offset electrical imbalances caused by fluid flowing through the nonconductive porous treatment medium.
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