- 专利标题： Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
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申请号： US11258274申请日： 2005-10-26
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公开(公告)号： US07129018B2公开(公告)日： 2006-10-31
- 发明人: Koji Saito , Kouichi Misumi , Toshiki Okui , Hiroshi Komano
- 申请人： Koji Saito , Kouichi Misumi , Toshiki Okui , Hiroshi Komano
- 申请人地址： JP Kanagawa
- 专利权人： Toyko Ohka Kogyo Co., Ltd.
- 当前专利权人： Toyko Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Hoffmann & Baron, LLP
- 优先权： JP2001-151131 20010521
- 主分类号： G03F7/038
- IPC分类号： G03F7/038
摘要：
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 μm thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
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