发明授权
- 专利标题： Method of embedding semiconductor chip in support plate and embedded structure thereof
- 专利标题（中）： 将半导体芯片嵌入支撑板及其嵌入结构的方法
-
申请号： US11008964申请日： 2004-12-13
-
公开(公告)号： US07129117B2公开(公告)日： 2006-10-31
- 发明人: Shih-Ping Hsu
- 申请人： Shih-Ping Hsu
- 申请人地址： TW
- 专利权人： Phoenix Precision Technology Corporation
- 当前专利权人： Phoenix Precision Technology Corporation
- 当前专利权人地址： TW
- 代理机构： Clark & Brody
- 代理商 William F. Nixon
- 优先权： TW93127248A 20040909
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plate having an opening and a second dielectric layer having a reinforced filling material are provided. The first dielectric layer mounted with the semiconductor chip, the support plate, and the second dielectric layer are pressed together, such that the semiconductor chip is received in the opening of the support plate, and the dielectric layers fill in a gap between the semiconductor chip and the opening of the support plate. The reinforced filling material of the dielectric layers can maintain flatness and consistency of the semiconductor chip embedded in the support plate, and fine circuits can be fabricated on the support plate by build-up and electroplating processes.