Invention Grant
- Patent Title: Chip to chip interface
- Patent Title (中): 芯片到芯片接口
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Application No.: US10854463Application Date: 2004-05-26
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Publication No.: US07129753B2Publication Date: 2006-10-31
- Inventor: Robert Walker
- Applicant: Robert Walker
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H03K19/0175
- IPC: H03K19/0175

Abstract:
A chip to chip interface comprising a signal line configured to receive a first signal and a receiver. The receiver is configured to provide a first output signal that corresponds to a first bit in response to a clock signal, wherein the receiver is configured to toggle the first bit based on the first output signal and in response to the first signal.
Public/Granted literature
- US20050265062A1 Chip to chip interface Public/Granted day:2005-12-01
Information query
IPC分类: