发明授权
- 专利标题: Method of manufacturing printed circuit boards using miniature contact block packagings
- 专利标题(中): 使用微型接触块包装制造印刷电路板的方法
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申请号: US10861161申请日: 2004-06-05
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公开(公告)号: US07131192B2公开(公告)日: 2006-11-07
- 发明人: Robert Stanford
- 申请人: Robert Stanford
- 申请人地址: US IL Schaumburg
- 专利权人: Motorola, Inc.
- 当前专利权人: Motorola, Inc.
- 当前专利权人地址: US IL Schaumburg
- 代理商 Hisashi D. Watanabe
- 主分类号: H01R43/00
- IPC分类号: H01R43/00
摘要:
This invention is a method of manufacturing printed circuit boards using a contact block packaging to provide and support electrical contact blocks relative to a printed circuit board panel. The contact block packaging is situated adjacent to the printed circuit board panel, so that electrical contact blocks of the contact block packaging are aligned with circuit boards of the printed circuit board panel, but breakaway stems supporting the electrical contact blocks are offset from webbing of the printed circuit board panel. The electrical contact blocks are then soldered to the printed circuit boards. Thereafter, the breakaway stems of the contact block packaging and the webs of the printed circuit board panel are broken, so that the electronic contact blocks are decoupled from the rest of the contact block packaging and the printed circuit boards are decoupled from the rest of the printed circuit board panel.
公开/授权文献
- US20040229507A1 Miniature contact block packaging for printed circuit 公开/授权日:2004-11-18