发明授权
- 专利标题: Method for making an inkjet-head chip structure
- 专利标题(中): 制造喷墨头芯片结构的方法
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申请号: US10860240申请日: 2004-06-03
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公开(公告)号: US07134187B2公开(公告)日: 2006-11-14
- 发明人: Chien-Hung Liu , Jian-Chiun Liou , Chi-Ming Huang , Chia-Cheng Chiao , Chun-Jung Chen
- 申请人: Chien-Hung Liu , Jian-Chiun Liou , Chi-Ming Huang , Chia-Cheng Chiao , Chun-Jung Chen
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Welsh & Katz, Ltd.
- 优先权: TW92132074 20031114
- 主分类号: H05B3/00
- IPC分类号: H05B3/00
摘要:
A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
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