A transfer apparatus is provided for the transport of transfer objects such as glass substrates or semiconductor devices in which cleanliness and secure transport are of major concern. A plurality of air nozzles inject air through the plurality of air nozzles to hold a transfer object in place above or below the plurality of air nozzles without the plurality of air nozzles making contact with the transfer object. The plurality of air nozzles are positioned perpendicular to the transfer object to stop and/or engage the transfer object in a rest position. The plurality of air nozzles are inclined to a specified angle to move the transferred object in a desired direction. Advantageously, because the transfer object is moved without physical contact between the structure of the air nozzles and the transfer object, the transfer is secure, clean, and efficient.