发明授权
- 专利标题: Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
- 专利标题(中): 具有导电环的集成电路载体和与载体集成的半导体器件
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申请号: US10946929申请日: 2004-09-21
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公开(公告)号: US07135642B2公开(公告)日: 2006-11-14
- 发明人: C. F. Wang , Chang-Fu Chen
- 申请人: C. F. Wang , Chang-Fu Chen
- 申请人地址: TW
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW
- 代理机构: Edwards Angell Palmer & Dodge LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权: TW93107235A 20040318
- 主分类号: H01R12/04
- IPC分类号: H01R12/04
摘要:
An integrated circuit carrier with conductive rings and a semiconductor device integrated with the carrier are proposed. A plurality of concave structures are formed on the conductive rings at predetermined positions above which a plurality of wires traverse, the wires being provided for electrically connecting the carrier to a semiconductor chip mounted on the carrier. Therefore, an insulating effect between the wires and the conductive rings is provided to prevent short circuit, so as to maintain the performance of the semiconductor device.
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