- 专利标题： Wafer integrated rigid support ring
-
申请号： US10625635申请日： 2003-07-23
-
公开(公告)号： US07138326B2公开(公告)日： 2006-11-21
- 发明人: Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
- 申请人： Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corp.
- 当前专利权人： International Business Machines Corp.
- 当前专利权人地址： US NY Armonk
- 代理商 Robert A. Walsh; Anthony J. Canale
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.
公开/授权文献
- US20040135233A1 Wafer integrated rigid support ring 公开/授权日：2004-07-15
信息查询
IPC分类:
