Invention Grant
- Patent Title: Liquid manufacturing processes for panel layer fabrication
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Application No.: US11346219Application Date: 2006-02-03
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Publication No.: US07140941B2Publication Date: 2006-11-28
- Inventor: Albert M. Green , E. Victor George , N. Convers Wyeth
- Applicant: Albert M. Green , E. Victor George , N. Convers Wyeth
- Applicant Address: US CA San Diego
- Assignee: Science Applications International Corporation
- Current Assignee: Science Applications International Corporation
- Current Assignee Address: US CA San Diego
- Agency: Kilpatrick Stockton LLP
- Main IPC: H01J9/24
- IPC: H01J9/24

Abstract:
A method for manufacturing a light-emitting panel sandwiches a plurality of micro-components between two flexible substrates in a web configuration. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. The micro-components are disposed in sockets formed at pre-determined locations in a first dielectric substrate so that they are adjacent to electrodes imprinted in the first substrate. Dielectric layers and the conductors for acting as electrodes are formed using liquid processes or combined liquid and sheet processes, where liquid materials are applied to the surface of the underlying layer, then cured to complete the formation of layers. The assembled layers are coated with a protective coating and may include an RF shield. In one embodiment, patterning of the conductors is achieved by applying conductive ink using an ink jet process. In another embodiment, the conductors may be patterned photolithographically using a leaky optical waveguide as a contact mask.
Public/Granted literature
- US20060205311A1 LIQUID MANUFACTURING PROCESSES FOR PANEL LAYER FABRICATION Public/Granted day:2006-09-14
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