Invention Grant
- Patent Title: Single chip power amplifier and envelope modulator
- Patent Title (中): 单芯片功率放大器和包络调制器
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Application No.: US10869987Application Date: 2004-06-17
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Publication No.: US07145385B2Publication Date: 2006-12-05
- Inventor: Per-Olof Brandt , Jonas Persson
- Applicant: Per-Olof Brandt , Jonas Persson
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Main IPC: H03F3/38
- IPC: H03F3/38

Abstract:
RF polar modulation circuit has a self-compensated temperature stable envelope controller and self-compensated temperature stable power amplifier bias. The circuit has an adaptive current-to-voltage modulation interface with pre-distortion compensation capability. AM/PM distortion are compensated for envelope dependent power amplifier transistor biasing. Automatic compensation is provided for RF loads that are higher or lower than nominal loads. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).
Public/Granted literature
- US20050122164A1 Single chip power amplifier and envelope modulator Public/Granted day:2005-06-09
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