Invention Grant
US07146106B2 Optic semiconductor module and manufacturing method 有权
光学半导体模块及制造方法

Optic semiconductor module and manufacturing method
Abstract:
An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.
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