Invention Grant
- Patent Title: Optic semiconductor module and manufacturing method
- Patent Title (中): 光学半导体模块及制造方法
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Application No.: US10227051Application Date: 2002-08-23
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Publication No.: US07146106B2Publication Date: 2006-12-05
- Inventor: Jun Young Yang , Sang Ho Lee , Chul Woo Park
- Applicant: Jun Young Yang , Sang Ho Lee , Chul Woo Park
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: Gunnison, McKay & Hodgson, L.L.P.
- Agent Serge J. Hodgson
- Main IPC: H04B17/00
- IPC: H04B17/00

Abstract:
An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.
Public/Granted literature
- US20040036135A1 Optic semiconductor module and manufacturing method Public/Granted day:2004-02-26
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