发明授权
- 专利标题: Integratied liquid cooling system for electrical components
- 专利标题(中): 电气元件集成液体冷却系统
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申请号: US10900815申请日: 2004-07-27
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公开(公告)号: US07147043B2公开(公告)日: 2006-12-12
- 发明人: Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
- 申请人: Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
- 申请人地址: TW Taipei Hsien
- 专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址: TW Taipei Hsien
- 代理商 Wei Te Chung
- 优先权: TW92217355U 20030926
- 主分类号: F28D15/00
- IPC分类号: F28D15/00
摘要:
A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.
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