Invention Grant
US07148080B2 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
失效
用于在封装组件中连接引线框架的方法，用于形成芯片堆叠封装的方法和芯片堆叠封装
- Patent Title: Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
- Patent Title (中): 用于在封装组件中连接引线框架的方法，用于形成芯片堆叠封装的方法和芯片堆叠封装
-
Application No.: US10382591Application Date: 2003-03-07
-
Publication No.: US07148080B2Publication Date: 2006-12-12
- Inventor: Pyoung Wan Kim , Sang Hyeop Lee , Chang Cheol Lee , Gun Ah Lee
- Applicant: Pyoung Wan Kim , Sang Hyeop Lee , Chang Cheol Lee , Gun Ah Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR2002-042539 20020719
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.
Public/Granted literature
Information query
IPC分类:
