发明授权
US07148143B2 Semiconductor device having a fully silicided gate electrode and method of manufacture therefor 有权
具有全硅化物栅电极的半导体器件及其制造方法

Semiconductor device having a fully silicided gate electrode and method of manufacture therefor
摘要:
The present invention provides a semiconductor device, a method of manufacture therefor, and a method for manufacturing an integrated circuit. The semiconductor device (100), among other possible elements, includes a silicided gate electrode (150) located over a substrate (110), the silicided gate electrode (150) having gate sidewall spacers (160) located on sidewalls thereof. The semiconductor device (100) further includes source/drain regions (170) located in the substrate (110) proximate the silicided gate electrode (150), and silicided source/drain regions (180) located in the source/drain regions (170) and at least partially under the gate sidewall spacers (160).
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