发明授权
- 专利标题： Electronic component mounting structure onto board
- 专利标题（中）： 电子元件安装结构到板上
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申请号： US11035955申请日： 2005-01-18
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公开(公告)号： US07148430B2公开(公告)日： 2006-12-12
- 发明人: Teruyuki Toyoda , Naoki Hayashi
- 申请人： Teruyuki Toyoda , Naoki Hayashi
- 申请人地址： JP Kanagawa-Ken
- 专利权人： Teikoku Tsushin Kogyo Co., Ltd.
- 当前专利权人： Teikoku Tsushin Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa-Ken
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2004/010867 20040119
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H05K7/14
摘要：
A rotary electronic component is secured to a board by snap-in engagement of engagement portions provided on mounting portions of the electronic component with respective board engagement portions provided on the board. Terminal plates projecting from a side of the electronic component are bent toward the board. The distal end portions of the bent terminal plates are retained by a terminal plate retainer projecting from the side of the electronic component. The retained distal end portions of the terminal plates are connected to respective terminal plate connecting portions provided on the board.
公开/授权文献
- US20050205282A1 Electronic component mounting structure onto board 公开/授权日：2005-09-22
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