Invention Grant
- Patent Title: Circuit protection device
- Patent Title (中): 电路保护装置
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Application No.: US10835655Application Date: 2004-04-30
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Publication No.: US07148785B2Publication Date: 2006-12-12
- Inventor: Paul N. Becker , Sirikhit Maniraj , Martin Pineda , Anthony Vranicar , Francis M. Yankello , Frank Wasilewski
- Applicant: Paul N. Becker , Sirikhit Maniraj , Martin Pineda , Anthony Vranicar , Francis M. Yankello , Frank Wasilewski
- Applicant Address: US PA Middletown
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Middletown
- Main IPC: H01C7/10
- IPC: H01C7/10

Abstract:
A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.
Public/Granted literature
- US20040218329A1 Circuit protection device Public/Granted day:2004-11-04
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