Invention Grant
- Patent Title: Connector and image sensor module using the same
- Patent Title (中): 连接器和图像传感器模块使用相同
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Application No.: US10838061Application Date: 2004-05-03
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Publication No.: US07151251B2Publication Date: 2006-12-19
- Inventor: Sang-Ho Kim , Yeong-Seop Lee , Hyun-Ju Lee , Do-Hyung Lee
- Applicant: Sang-Ho Kim , Yeong-Seop Lee , Hyun-Ju Lee , Do-Hyung Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, L.L.C.
- Priority: KR10-2003-0064039 20030916
- Main IPC: G01J40/14
- IPC: G01J40/14 ; H01L27/00 ; H01L31/203

Abstract:
A conductive connector for use by an image module connects electrically a first electric circuit substrate having a first conductive pattern to a second electric circuit substrate having a second conductive pattern. The conductive connector includes an insulating substrate located between the first electric circuit substrate and the second electric circuit substrate, and has at least one hole formed by perforation, and a conductive filling material filled in the hole for electrically connecting the first conductive pattern to the second conductive pattern.
Public/Granted literature
- US20050059269A1 Connector and image sensor module using the same Public/Granted day:2005-03-17
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