发明授权
- 专利标题： Superconductor connection structure
- 专利标题（中）： 超导体连接结构
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申请号： US10387591申请日： 2003-03-14
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公开(公告)号： US07152302B2公开(公告)日： 2006-12-26
- 发明人: Hiroshi Morita , Kazuhide Tanaka , Yasuo Suzuki , Michiya Okada
- 申请人： Hiroshi Morita , Kazuhide Tanaka , Yasuo Suzuki , Michiya Okada
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Crowell & Moring LLP
- 优先权： JP2001-208675 20010710
- 主分类号： H01L39/24
- IPC分类号： H01L39/24 ; H01B12/00
摘要：
A method of producing an electrical connection structure between at least two superconducting lines. The method comprises adding metal powder or alloy powder to a superconducting material comprising magnesium diboride, intervening the superconducting material between at least two superconducting lines, and heating said superconducting lines and said superconducting material to a temperature lower than the melting point of said superconducting material prior to the addition of said metal powder or alloy powder thereto, but higher than the melting point of said metal powder or alloy powder.
公开/授权文献
- US20030173103A1 Superconductor connection structure 公开/授权日：2003-09-18