Invention Grant
US07152318B2 Method for manufacturing built-up printed circuit board with stacked type via-holes
有权
具有层叠型通孔的叠层印刷电路板的制造方法
- Patent Title: Method for manufacturing built-up printed circuit board with stacked type via-holes
- Patent Title (中): 具有层叠型通孔的叠层印刷电路板的制造方法
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Application No.: US10603764Application Date: 2003-06-26
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Publication No.: US07152318B2Publication Date: 2006-12-26
- Inventor: Bong-Suck Kim , Gye-Soo Kim , Jong-Hyung Kim , Il-Woon Shin
- Applicant: Bong-Suck Kim , Gye-Soo Kim , Jong-Hyung Kim , Il-Woon Shin
- Applicant Address: KR
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR
- Agency: Morgan, Lewis & Bockius, LLP
- Priority: KR10-2002-0079216 20021212
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly screen of a general screen printing machine.
Public/Granted literature
- US20040112637A1 Built-up printed circuit board with stacked via-holes and method for manufacturing the same Public/Granted day:2004-06-17
Information query
