A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboard. The contact plates have side notches and bottom recesses of various shapes and dimensions, as well as through holes extending through the entire width of the contact plates to facilitate the glue flow for filling out the side notches and bottom recesses for improved solidifying of the LED package. The contact plates have portions uncovered by the glue to provide extended areas for soldering to a motherboard.