发明授权
- 专利标题： Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
- 专利标题（中）： 半导体装置用基板片材及其制造方法，使用基板片材的成型方法，半导体装置的制造方法
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申请号： US10718677申请日： 2003-11-24
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公开(公告)号： US07157311B2公开(公告)日： 2007-01-02
- 发明人: Kouichi Meguro , Toru Nishino , Noboru Hayasaka
- 申请人： Kouichi Meguro , Toru Nishino , Noboru Hayasaka
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrain, LLP.
- 优先权： JP2002-342964 20021126
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.
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