Invention Grant
- Patent Title: Method and apparatus for processing a wafer
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Application No.: US10229446Application Date: 2002-08-27
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Publication No.: US07159599B2Publication Date: 2007-01-09
- Inventor: Steven Verhaverbeke , J Kelly Truman , Christopher T Lane , Sasson R Somekh
- Applicant: Steven Verhaverbeke , J Kelly Truman , Christopher T Lane , Sasson R Somekh
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: B08B3/00
- IPC: B08B3/00
Abstract:
A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.
Public/Granted literature
- US20030045131A1 Method and apparatus for processing a wafer Public/Granted day:2003-03-06
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